1. The brightness of light sources at different positions can be set independently according to product functions, effectively addressing product discrepancies.
2. Main functions: Magazine loading (25 iron rings), compound cleaving & scribing, fully automatic film laminating and fully automatic cleaving.
3. Equipped with industrial vision system for efficient recognition of wafer contours and notches.
4. Supports fully automatic operation for various products including wafers, bars, potassium nitride bars and cells.
5. Compliant with SEMI standards and SECS-GEM communication protocol.
Our key equipment models serve multiple chip segments such as optical devices, laser chips and optical communication chips.
Parameter | Value |
Substrate Material | GaAs, InP, GaN, SiC, Si and other substrates |
Processing Size | 4/6/8 inch |
Bar Chips | Bar dimension: 4.5mm30mm; Single chip: 0.10mm4.5mm |
X-Y Travel Range | 160mm*160mm |
Positioning Accuracy | Repeat positioning accuracy: ±2μm; Positioning accuracy: ±2μm |
Transmission System | Load port, robot, aligner |
