1. Max. processing area: 730 mm × 920 mm, with flexible compatibility for various substrate sizes.
2. Femtosecond laser enables high‑throughput processing with superior quality.
3. Self-developed processing and control systems.
4. Integrated high‑precision automatic alignment and compensation system.
5. Fully automatic unattended operation.
6. Backed by multiple patents and proprietary core technologies.
Mainly used for through‑glass via (TGV) etching of reinforced glass.
Machine Model | Panel‑Level Femtosecond Laser TGV Etching Equipment for Reinforced Glass |
Max. Processing Size | 730x920mm |
Hole Position Accuracy | 5μm |
Travel Speed | ≥800mm/s |
Hole Roundness (Outer‑hole & Inner‑hole)） | ≥95% (Major‑axis / Minor‑axis) |
Hole‑wall Surface Roughness | ≤100nm (Subject to material and etching capacity) |
